D.Cool
As demand for GPU/CPU capacity surges, you need hardware on-site fast. We import racks and key cooling components directly from Thailand and Taiwan, giving you a faster, more efficient path to powering your AI clusters. Our modular approach supports rapid expansion and helps you bring compute online sooner—so you can recycle capital faster and scale without bottlenecks.
Liquid Cooling Solutions
Direct-to-Chip cooling for GPU/CPU
D.Cool cold plate design is optimized for maximum cooling performance with advanced materials non-oxygen copper, additive manufacturing method that enables perk reliability for hyperscale compute and data center applications. Its design and 3 D manufacturing technology strategies deliver unparalleled quality. Each cold plates are 100% leak tested to verify quality following precision CNC machining and brazing manufacturing processes.
Coolant Distribution Units
Optimize Liquid Cooling for ArtificiaI Intelligence
In the age of AI, Direct-liquid-Cooling to chip is the key to dissipate heat from CPU/GPU. D.Cool Coolant Distribution Units (CDUs) are the cornerstone of efficient liquid cooling systems designed for today’s AI-driven data centers.
Nowadays, AI workloads push the boundaries of performance, our CDUs deliver the precision and reliability necessary to keep your critical infrastructure operating at peak efficiency.
High-Density AI Workloads
D.Cool CDUs offer unparalleled flexibility, with three standard models and custom OEM configurations that scale to support up to 2.0 MW of IT load. We offer both in-row and in-rock models to fulfill high demand.
Unequaled Reliability with Built-In Redundancy
0.1% Downtime is not an option in AI. D.Cool CDUs are built with advanced redundancy and resiliency features, ensuring IT systems stay operational even in the most demanding environments.
Build-in PLC control and safety systems provide the precision and oversight necessary to maintain maximum cooling performance, safeguarding cooling rack and high-performance computing output.
ORv3 OPEN RACK SOLUTIONS
OCP approved
Unleash the power of next-generation data center infrastructure with D.Cool|Cheval ORv3 rack, designed to meet the stringent standards set forth by the Open Compute Project (OCP).
As a global market leader in Open Rack enclosures, D.Cool|Cheval brings unparalleled expertise and innovation to each step of the process, from initial concept to integration and final system assembly as OCP standard. With our proven track record in enclosure manufacturing and global partner’s support is to be ensuring that your data center needs are in capable hands.
Main features:
• Accommodates mounting for liquid cooling manifolds to support cold plate technology and allow higher power density (30 kW per rack)
• Flexible design for multiple functions
• Busbar system that avoids unreliable power cord connection
• 21-inch OU or 19-inch RU hardware swappable
• Compatible with all Open Rack IT systems
• Tool-free rack assembly
• Optional side panels and doors
Edge AI
Edge AI is exactly as the phrase indicates, combining edge computing with artificial intelligence. Computing on the edge means processing and communication is fully carried out on the “edge” of a local network, with no need to connect to the cloud or an external server. Combining this with AI gives you all the tools to predict, asses, and control automatically on one “homebase” network. With edge AI, even complex computation is made possible fully on-site.
Reduced Latency: Without a connection to an external server or access data in the cloud, an edge AI system can collect, process, and draw conclusions about information at a high speed.
Real-Time Processing: Fast response times coupled with smart AI lets decisions happen in mission-critical settings with accurate response timing. Operations can halt or pivot in time to prevent any error, rather than reacting when something goes wrong.
Security: Sensitive data is safer than ever in edge AI systems, where data never leaves the facility in which it’s collected.
