Direct to Chip Cooling
Our comprehensive direct-to-chip cooling solutions span air cooling, high-efficiency direct-to-chip liquid cooling, and advanced immersion cooling. These technologies maximize thermal density and enable higher processing power in the most compact servers for AI factory and Data Centers. They support GPU/CPU chips heat dispassion up to 750 m.K/watts to 1,800 m.K/watts.
Server Opened-Loop Series A4
Waterblock
Dimensions:
Base:
Principalpart:
142*80*25mm
Aluminum
Aluminum
Tube
Power dissipation
Compatible Socket & CPU
Dimensions:
Material:
Φ 10*400mm
FEP
200~2000w
Customizable
Liquid Cooling Module-LCM TS2U-MP-001
Waterblock
Dimensions:
Base:
Principalpart:
107*80*24mm
Copper
PPS
Pump
Model:
Voltage:
Speed:
A4
12V
4000RPM
Radiator
Dimensions:
Material:
458*61*56mm
Aluminum
Tube
Dimensions:
Material:
Φ13*310mm
EPDM
Fan
Dimensions:
Voltage:
Speed:
Air flow{max}:
Prerssure{max}:
Noise:
Quantity:
60*60*38mm
12V
15000RPM
57.74CFM
64.08mm/H20
61.4 dBA
6Pcs
Power dissipation
Compatible Socket & CPU
600w
Intel LGA 3647/4189/4677 AMD TR4
Solutions for Thermal Management
-
NGC – Radar and Directed Energy Programs
-
Cobham – High Power FETs
-
Raytheon – Mid- and High-Band Applications
-
Lockheed – High Power Chip Carriers
Thermal Conductivity Comparison
Material
CVD Diamond
Diacool AG850*
Diacool AG700*
Diacool CU600*
Diacool Al500*
Silver
Copper
Beryllium Oxide
Gold
Beryllium Oxide
Cu-Mo-Cu 20/60/20
Aluminum
WCu 75/25
Cu-Mo-Cu 13/74/13
Aluminum Nitride
WCu 80/20
WCu 90/10
Aluminum Silicon Carbide
Tungsten
Molybdenum Copper 85/15
Thermal Conductivity (W/m·K)
1200–2200
AG850*850
AG700*700
CU600*600
Al500*500
425
390
325
Gold300
280
242
237
220
208
200
200
180
180
165
145