Our design and engineering teams work closely with customers to develop infrastructure solutions for modern computing environments. From system layouts to cooling integration, we focus on designs that support high-performance data centers and evolving technology demands.
Modern AI workloads demand more than conventional infrastructure. From ORv3 Open Rack architecture to high-density liquid cooling systems, our engineering services are built to support mission-critical environments operating at 65kW+ per rack and beyond.
We design solutions aligned with OCP standards, optimized for direct-to-chip precision cooling, and engineered for scalability up to 1 MW power racks. Every system is developed with performance, redundancy, and long-term serviceability in mind.
As GPU and CPU performance scales, thermal density increases exponentially. Our engineering solutions integrate direct-to-chip cold plate optimization, ORv3 rack standards, and AI-ready CDU infrastructure to support extreme compute loads without compromising reliability.
Next-generation power racks demand intelligent distribution and modular expansion. From HVDC busbars to integrated power shelves and rack controllers, our engineering frameworks are built to scale from pilot deployments to full AI factory buildouts.
Next-generation power racks demand intelligent distribution and modular expansion. From HVDC busbars to integrated power shelves and rack controllers, our engineering frameworks are built to scale from pilot deployments to full AI factory buildouts.
